reflow soldering
- Thread starter terry
- Start date
don't let the hot gun touch the solder. if I were you, I would test out using scrap pcb or equipment using the solder you're going to be use
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The critical part with any soldering is make sure everything is clean and free of contaminants. Also,
the soldering tip should be tinned prior to use. Make sure you have some rosin; either within the solder or a liquid/paste rosin.
Wannabee
the soldering tip should be tinned prior to use. Make sure you have some rosin; either within the solder or a liquid/paste rosin.
Wannabee
I didn't think the reflow process used a solder gun?
Isn't it a process by which one applies paste, places the parts, and bakes the PCB using a very specific time/heat timeline?
I have seen many videos on you tube including the use of a hot air gun, frying pan, and a cheap conventional electric oven from Walmart.
Isn't it a process by which one applies paste, places the parts, and bakes the PCB using a very specific time/heat timeline?
I have seen many videos on you tube including the use of a hot air gun, frying pan, and a cheap conventional electric oven from Walmart.
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Here is a good video: https://www.youtube.com/watch?v=Jtx_egzor8g">https://www.youtube.com/watch?v=Jtx_egzor8g</a>
You want to use a soldering iron, not a soldering gun. Soldering guns are used in bigger applications. Also, I stated rosin in my response above this one. It should have been flux in a liquid/paste form. I believe that ghbrewer, here at ARC upgraded some Radion pucks so months back. Maybe you could PM and ask how here did his modification.
Wannabee
You want to use a soldering iron, not a soldering gun. Soldering guns are used in bigger applications. Also, I stated rosin in my response above this one. It should have been flux in a liquid/paste form. I believe that ghbrewer, here at ARC upgraded some Radion pucks so months back. Maybe you could PM and ask how here did his modification.
Wannabee
reflow is technically heating up of the solder paste on the pins of the IC or under the IC if the IC uses BGA in order to cure any solder issue.
